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Groundbreaking interconnection technology using 200 nm nanowires to realize tomorrow’s high-performance electronics. (close-up) © Fraunhofer IZM
Groundbreaking interconnection technology using 200 nm nanowires to realize tomorrow’s high-performance electronics. (close-up) © Fraunhofer IZM
Lubricants based on polymers make the process of wire drawing significantly more environmentally friendly and economical. Kristin Stein © Fraunhofer IAP © Fraunhofer IAP
“µDRAL” plant – first direct reduction plant flexibly operated with hydrogen and natural gas in an integrated mill. © Salzgitter
Fig. 1: The Fraunhofer IWM material model predicts the microstructure evolution during wire manufacturing. The computational variation of the process conditions allows to predict their effects on the product properties. © Fraunhofer IWM
The organizer is a consortium of five partners – Aurubis, Balloffet, Bechem, Niehoff and the Kupferverband. © NF Wire Forum
Sealed the cooperation at Finkernagel's headquarters in Altena, from left to right: Uwe Braun (CEO Arcelor Mittal Hamburg), Markus Rathmann (Chief Supply Chain Officer Ejot), Timo Finkernagel (Managing Director Finkernagel). © ArcelorMittal