WIRE magazine will be on show at “wire” with its own stand in hall 9, booth C 03. Come and see us at the end of your day at the fair – we look forward to an exchange of views with exhibitors and trade visitors. © Meisenbach
Typical quality issues on the outer cable surface due to byproducts. © Maillefer
Setic high speed 1,250mm assembling single twist. © Setic
New Topography scanner. © Maillefer
“QCS 3000” is intended especially for splicing of Al/Cu Milliken conductors. © Maillefer
As for the exhibits, visitors will see the MXC 120mm extruder for low-voltage applications, and the compact fiber pay-off PM 265, to mention a few visible on the stand. © Maillefer
From left to right: Lars Gestranius, Director, Project Engineering & Quality; Daria Graul, Quality Manager; and Lars Fagerholm, President, Davis-Standard Infrastructure Business Unit, Maillefer Group. © Maillefer