04/09/2025 – EJP Wire technology complements established dry grinding with newly developed wet grinding system
Wire grinding – proven technology, new possibilities
Wire grinding is an integral part of the wire industry's process chain. Whether for removing scale or oxide layers, reducing surface defects or preparing for subsequent electroplating or forming processes, the grinding process is critical component of the production process.
Wire grinding is an integral part of the wire industry's process chain. © EJP Wire Technology
With its new wet grinding system, EJP Wire Technology is responding to increasing demands in the field of high-quality wire products. © EJP Wire Technology
With the option of inline coating, this offers a genuine alternative to conventional wire coil cleaning processes.
With decades of experience in modular wire processing systems, EJP Wire Technology has now developed its first wet grinding system for wire applications. It was designed as a technological addition to classic dry grinding and is now available as a new option – ideally suited for applications with high demands on surface quality and process reliability.
The development was carried out in collaboration with Platestahl Umformtechnik GmbH, based in Lüdenscheid, which specializes in the manufacturing and processing of steel products. The company attaches great importance to quality, precision and the implementation of individual customer requirements.
Dry grinding – the robust standard
Dry grinding has established itself world-wide wire mills as a reliable and efficient process. The process is ideally suited in applications with high scale formation or in the processing of starting materials for drawing processes, due to:
– High removal rate, even with multiple layers of scale
– Removal of wire surface defects
– Flexibility in surface finish through the choice of grinding belt
– Easy integration into existing lines thanks to compact design and autonomous control
– Low maintenance
This makes dry grinding an economical solution for standard applications in wire rod preparation for subsequent processing steps.
Wet grinding – new standards for precision and safety
With its new wet grinding system, EJP Wire Technology is responding to increasing demands in the field of high-quality wire products – especially for applications where the finest surfaces and/or emission-free operation are required.
The functional principle is based on the classic grinding module, but with a central extension: the grinding process takes place under continuous water cooling, whereby the particles produced are bound directly in the liquid and discharged via an integrated filter system.
Technological advantages at a glance:
– Lower temperature input – improves the structural stability of the wire
– Finest, uniform surface roughness – production of finish surfaces, ideal for subsequent coating processes and precision forming, especially in medical technology
– Use of existing grinding belt technology – economical and compatible
– Fire protection by preventing dust formation and sparking
– No dust exposure for personnel and the work area
Two processes – one decision based on requirements
The choice between dry and wet grinding depends on the product-specific requirements. While dry grinding offers advantages for material removal, such as scale removal, wet grinding is the ideal solution for smaller dimensions, safety-related or material-critical applications.
EJP Wire Technology now offers both processes – with modular integration, identical operating logic and coordinated process peripherals. This enables wire processors to flexibly adapt their grinding strategy to different requirements and products.
Further development of a proven process
The new wet grinding system is not a replacement for established dry grinding. It expands the technological range in wire processing and opens up new possibilities for precise, clean and safe processes.
With this innovation, EJP Wire Technology and Platestahl Umformtechnik GmbH are once again positioning themselves as solution providers for customized, forward-looking solutions.
Expertise for the entire process chain
As a company of the EJP Group, EJP Wire Technology develops machines and systems for the entire wire manufacturing process chain – from wire preparation to straightening, grinding, drawing and cleaning.
Together with EJP Maschinen GmbH, we will once again be exhibiting at WIRE Southeast Asia 2025, hall EH 102, booth J08, in Bangkok, Thailand. We look forward to welcoming you on our booth from September 17 to September 19, 2025.
wire Southeast Asia 2025, hall EH 102, booth J 08
EJP Wire Technology GmbH
Lohbachstrasse 12
58239 Schwerte, Germany
Contact person is Marvin Potschien
Tel.: +49 (0)2304 338 96-13
m.potschien@ejpwire.com
