16/07/2026 – High-speed tungsten carbide fine-size die polishing machine
Mikrotek with “MTCFS”
Mikrotek Machines Limited has achieved a major technological milestone with the launch of “MTCFS” (Tungsten Carbide Fine Size Machine). India’s first high-speed, high-precision solution dedicated to coning and polishing fine-size tungsten carbide wire-drawing dies.
“MTCFS”: India’s first high-speed fine-size tungsten carbide wire- drawing die grinding and polishing machine. © Mikrotek
“MTCFS”: India’s first high-speed fine-size tungsten carbide wire- drawing die grinding and polishing machine. © Mikrotek