16/07/2026 – High-speed tungsten carbide fine-size die polishing machine
Mikrotek with “MTCFS”
Mikrotek Machines Limited has achieved a major technological milestone with the launch of “MTCFS” (Tungsten Carbide Fine Size Machine). India’s first high-speed, high-precision solution dedicated to coning and polishing fine-size tungsten carbide wire-drawing dies.
“MTCFS”: India’s first high-speed fine-size tungsten carbide wire- drawing die grinding and polishing machine. © Mikrotek
Designed to international manufacturing standards, the “MTCFS” precisely handles wire sizes from 0.15mm to 1.50mm, delivering tight dimensional tolerances, low ovality, and mirror-grade surface finishes across aluminium, stainless steel, and nickel alloys. Powered by Mikrotek’s proprietary engineering and automation, the “MTCFS” combines high-speed productivity with exceptional accuracy, extended die life, and repeatable quality.
With a production capacity of 10,000 wire-drawing dies per month and installations supporting manufacturers worldwide, Mikrotek continues to elevate global benchmarks in wire and cable manufacturing. From its state-of-the-art facility in India, the company delivers solutions that help producers draw more – better, faster, and longer.
Mikrotek Machines Ltd.
Tel.: +91 9148135975
